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Key properties:
Thermal conductive silica gel
Low shrinkage rate
Good water resistance
High material stability
Slow thermal conductivity attenuation
Thermal conductivity: 2.0 to 4.5 W/mk, low thermal impedance
Common applications: transistors, central processing units (CPU), thermistor, temperature sensors, automative electronics, small refrigerators, power modules, printers.
Test conducted in environment of 70% humidity and 25 °C.
