Thermal Paste, ID-S6

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal conductive silica gel

  2. Low shrinkage rate

  3. Good water resistance

  4. High material stability

  5. Slow thermal conductivity attenuation

  6. Thermal conductivity: 2.0 to 4.5 W/mk, low thermal impedance


Common applications: transistors, central processing units (CPU), thermistor, temperature sensors, automative electronics, small refrigerators, power modules, printers.


Test conducted in environment of 70% humidity and 25 °C.








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Viscosity, Thermal Paste

Contact us for your Thermal Interface Materials sourcing needs. Viscosity refers to how 'thick' or 'thin' the material (e.g. thermal paste) is. The higher the viscosity, the thicker the paste.

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