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Key properties:
Thermal conductive pad
Very soft and highly compressible
Naturally sticky
Thermal conductivity: 3.0 W/mk, low thermal impedance
Common applications: Integrated circuits (IC), central processing units (CPU), Metal–Oxide–Semiconductor (MOS), Light Emitting Diode (LED), heat sink, LCD televisions, computers, telecommunication devices.
Test conducted in environment of 70% humidity and 25 °C.
