Thermal conductive pad
Very soft and highly compressible
Thermal conductivity: 2.5 W/mk, low thermal impedance
Common applications: Integrated circuits (IC), central processing units (CPU), Metal–Oxide–Semiconductor (MOS), Light Emitting Diode (LED), heat sink, LCD televisions, computers, telecommunication devices.
Test conducted in environment of 70% humidity and 25 °C.