Thermal Pad, ID-S3

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal conductive pad

  2. Very soft and highly compressible

  3. Naturally sticky

  4. Thermal conductivity: 7.0 W/mk, low thermal impedance

  5. UL94 flammability rating: V-0


Common applications: Integrated circuits (IC), central processing units (CPU), Metal–Oxide–Semiconductor (MOS), Light Emitting Diode (LED), heat sink, LCD televisions, computers, telecommunication devices.


Test conducted in environment of 70% humidity and 25 °C.







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Viscosity, Thermal Paste

Contact us for your Thermal Interface Materials sourcing needs. Viscosity refers to how 'thick' or 'thin' the material (e.g. thermal paste) is. The higher the viscosity, the thicker the paste.

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