Thermal Adhesive, ID-S8

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal conductive adhesive glue

  2. Bi-component epoxy non-solvent adhesive

  3. Low thermal resistance

  4. Curable at room temperature

  5. Low shrinkage

  6. Waterproof

  7. Strong adhesion

  8. High material stability

  9. Slow thermal conductivity attenuation


Common applications: chip-on-board (COB), photovoltaic system and other electronics.


Basic Properties

Test conducted in environment of 70% humidity and 25 °C.


Cured Properties

Test conducted in environment of 70% humidity and 25 °C.


Complete Curing Time


Operation Time






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Viscosity, Thermal Paste

Contact us for your Thermal Interface Materials sourcing needs. Viscosity refers to how 'thick' or 'thin' the material (e.g. thermal paste) is. The higher the viscosity, the thicker the paste.