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Updated: Jan 7

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal conductive silica gel

  2. Low shrinkage rate

  3. Good water resistance

  4. High material stability

  5. Slow thermal conductivity attenuation

  6. Thermal conductivity: 2.0 to 4.5 W/mk, low thermal impedance


Common applications: transistors, central processing units (CPU), thermistor, temperature sensors, automative electronics, small refrigerators, power modules, printers.


Test conducted in environment of 70% humidity and 25 °C.








Updated: Jan 7

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal conductive pad

  2. Very soft and highly compressible

  3. Naturally sticky

  4. Thermal conductivity: 3.0 W/mk, low thermal impedance

  5. UL94 flammability rating: V-0


Common applications: Integrated circuits (IC), central processing units (CPU), Metal–Oxide–Semiconductor (MOS), Light Emitting Diode (LED), heat sink, LCD televisions, computers, telecommunication devices.


Test conducted in environment of 70% humidity and 25 °C.




Updated: Jan 7

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal conductive pad

  2. Very soft and highly compressible

  3. Naturally sticky

  4. Thermal conductivity: 5.0 W/mk, low thermal impedance

  5. UL94 flammability rating: V-0

Common applications: Integrated circuits (IC), central processing units (CPU), Metal–Oxide–Semiconductor (MOS), Light Emitting Diode (LED), heat sink, LCD televisions, computers, telecommunication devices.


Test conducted in environment of 70% humidity and 25 °C.