Learn about what we do

Updated: Jan 7

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Long-lasting

  2. Low thermal impedance

  3. High temperature resistance

  4. Electrical insulation

  5. Low consistency


Common applications: transistors, central processing units (CPU), thermistor, temperature sensors, automative electronics, small refrigerators, power modules, printers.


Test conducted in environment of 70% humidity and 25 °C.






Updated: Jan 7

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal conductive adhesive glue

  2. Bi-component epoxy non-solvent adhesive

  3. Low thermal resistance

  4. Curable at room temperature

  5. Low shrinkage

  6. Waterproof

  7. Strong adhesion

  8. High material stability

  9. Slow thermal conductivity attenuation


Common applications: chip-on-board (COB), photovoltaic system and other electronics.


Basic Properties

Test conducted in environment of 70% humidity and 25 °C.


Cured Properties

Test conducted in environment of 70% humidity and 25 °C.


Complete Curing Time


Operation Time






Updated: Jan 7

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal double-sided tape

  2. Very soft

  3. Self-adhesive

  4. High compression ratio

  5. Naturally sticky

  6. Thermal conductivity: 0.4 W/mk, low thermal impedance


Common applications: Integrated circuits (IC), central processing units (CPU), Metal–Oxide–Semiconductor (MOS), Light Emitting Diode (LED), heat sink, LCD televisions, computers, telecommunication devices.


Test conducted in environment of 70% humidity and 25 °C.







©2021 Everybase Pte. Ltd, Singapore