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Updated: Jan 7

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal conductive pad

  2. Very soft and highly compressible

  3. Naturally sticky

  4. Thermal conductivity: 3.5 W/mk, low thermal impedance

  5. UL94 flammability rating: V-0






Updated: Jan 7

Contact us for your electronics potting sealant sourcing needs. Quote title to reference this product.


Key properties:

  1. Low pre-curing viscosity

  2. High impact resistance

  3. Good water and moisture resistance

  4. Good heat and cold resistance

  5. Cures at room temperature






Updated: Jan 7

Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.


Key properties:

  1. Thermal conductive pad

  2. Very soft and highly compressible

  3. Naturally sticky

  4. Thermal conductivity: 6.0 W/mk, low thermal impedance

  5. UL94 flammability rating: V-0


Test conducted in environment of 70% humidity and 25 °C.