Dec 21, 20201 min readThermal Pad, ID-S15Updated: Jan 7Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.Key properties:Thermal conductive padVery soft and highly compressibleNaturally stickyThermal conductivity: 3.5 W/mk, low thermal impedanceUL94 flammability rating: V-0Thermal Interface Materials (TIM)•Products0 comments
Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.Key properties:Thermal conductive padVery soft and highly compressibleNaturally stickyThermal conductivity: 3.5 W/mk, low thermal impedanceUL94 flammability rating: V-0
Dec 21, 20201 min readElectronics Potting Sealant, ID-S14Updated: Jan 7Contact us for your electronics potting sealant sourcing needs. Quote title to reference this product.Key properties:Low pre-curing viscosityHigh impact resistanceGood water and moisture resistanceGood heat and cold resistanceCures at room temperatureProducts•Electronics Potting Sealants0 comments
Contact us for your electronics potting sealant sourcing needs. Quote title to reference this product.Key properties:Low pre-curing viscosityHigh impact resistanceGood water and moisture resistanceGood heat and cold resistanceCures at room temperature
Dec 21, 20201 min readThermal Pad, ID-S13Updated: Jan 7Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.Key properties:Thermal conductive padVery soft and highly compressibleNaturally stickyThermal conductivity: 6.0 W/mk, low thermal impedanceUL94 flammability rating: V-0Test conducted in environment of 70% humidity and 25 °C.Thermal Interface Materials (TIM)•Products0 comments
Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.Key properties:Thermal conductive padVery soft and highly compressibleNaturally stickyThermal conductivity: 6.0 W/mk, low thermal impedanceUL94 flammability rating: V-0Test conducted in environment of 70% humidity and 25 °C.