Updated: Jan 7
Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.
Key properties:
Thermal conductive pad
Very soft and highly compressible
Naturally sticky
Thermal conductivity: 3.5 W/mk, low thermal impedance
Updated: Jan 7
Contact us for your electronics potting sealant sourcing needs. Quote title to reference this product.
Key properties:
Low pre-curing viscosity
High impact resistance
Good water and moisture resistance
Good heat and cold resistance
Cures at room temperature
Updated: Jan 7
Contact us for your Thermal Interface Materials sourcing needs. Quote title to reference this product.
Key properties:
Thermal conductive pad
Very soft and highly compressible
Naturally sticky
Thermal conductivity: 6.0 W/mk, low thermal impedance
Test conducted in environment of 70% humidity and 25 °C.
